Capabilities

ENGINEERING:

Design
Layout
Dxf to gerber
Gerber to Dxf
Reverse engineering
Panelization
Paste File

BOARD TYPE:

Single sided
Double Sided
Multi-layers
Thru Holes and Surface Mount

MATERIALS:

FR4 (TG of 170/180+)
GETEK
CEM-1
CEM-3
ARLON
TACONIC
ROGERS
TEFLON laminate circuit boards for RF and microwave industries.
COMPOSITE multi layers
ALUMINUM backed single layers boards for LED lighting industry
CONDUCTIVE bonding of any printed circuit boards to aluminum, brass, and copper machined carriers and housings.
ANTENNA’s (Large communication, conical, cylindrical, conformal multi layers and geometric).
CERAMIC substrate circuitry

MATERIAL THICKNESS:

0.001 to 0.250

SPECIAL CAPABILITIES:

Board size up to 36 inches
Finished CU thickness up to 4 oz
Fine line application, width/space 005/005
Smallest hole 0.008
Mixed technology
Plated and non plated slots.
Edge plating

SOLDER MASK:

Green
Blue
Red
White
Black
Yellow

SILK SCREEN INKS:

White
Black
Red
Yellow

FINISHES:

Hot air Leveled solder (tin/lead and lead free solder)
Electroless Emmersion nickel/immersion gold
Hard gold plating
Gold tabs
White Tin
Immersion Silver.
Carbon and resistive ink.
Peelable mask

FABRICATION:

Routing
Tab routing
Scoring and Jump scoring
Panelization
Countersink and counter bore drilling
Edge Beveling

STANDARDS:

UL APPROVED
RoHS Compliant
Lead-free
100% electrical Testing(Fixture and probe)
100% In-Process Inspection
ISO 9002 QUALITY SYSTEMS SPECIFICATIONS
FINAL INSPECTION – 100% of fabricated material

Prototype Turn Around

24 HOUR