Dxf to gerber
Gerber to Dxf
Thru Holes and Surface Mount
FR4 (TG of 170/180+)
TEFLON laminate circuit boards for RF and microwave industries.
COMPOSITE multi layers
ALUMINUM backed single layers boards for LED lighting industry
CONDUCTIVE bonding of any printed circuit boards to aluminum, brass, and copper machined carriers and housings.
ANTENNA’s (Large communication, conical, cylindrical, conformal multi layers and geometric).
CERAMIC substrate circuitry
0.001 to 0.250
Board size up to 36 inches
Finished CU thickness up to 4 oz
Fine line application, width/space 005/005
Smallest hole 0.008
Plated and non plated slots.
Hot air Leveled solder (tin/lead and lead free solder)
Electroless Emmersion nickel/immersion gold
Hard gold plating
Carbon and resistive ink.
Scoring and Jump scoring
Countersink and counter bore drilling
100% electrical Testing(Fixture and probe)
100% In-Process Inspection
ISO 9002 QUALITY SYSTEMS SPECIFICATIONS
FINAL INSPECTION – 100% of fabricated material